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Usage of Elfo Blaster for minute powder

Fablication of precise patterns

Minimum patterns

Width of lines :20um, Dot hole :40um, Pin pole :30um

Aspect ratio

2 times to 8 times of high aspect avairable

Work materials

Brittle materials , such as crystal, glass, ceramics, compound semiconductor, silicon wafer, sapphire and metals

Content of processing

Drilling, Dicing, Pin pole, Grooving

Processing examples

プラズマディスプレイの放電空間形成図
Rib formation for PDPLine:30um,High:180um
ガラス溝加工SEM写真
Ditch processing of glass Line:20um

セラミックピン立て加工図
Pin formation of ceramic
セラミックギア加工図
Processing for ceramic gear

ダイシング用溝加工図
Ditch processing for dicingLine:30um

Dimple processing

ステンレスパターン切削加工図
Processing for stainless patternDepth: 35um

Micro Shot Peening


Constant blasting fine abrasive particles by high air pressure increases the strength of metal surface strength improvement of work material by fine abrasive particles wituout damaging..

As a result, longevity in cutlery and the metallic part can be greatly extended

銅のブラストコーティング図

Blast Coating

Metallic thin coating on plastics, glass and ceramics are available by blasting metallic particles with a high pressured nitrogen gas.

Plastic thin coating on metal, ceramic and glass are available by blasting powder, such as PTFE..


Blast coating of copper to the almina board
銀のブラストコーティング図
Blast coating of silver to the glass
Line width:150um Space:45um

Suface Dulling

Fine dull finishing on the surface of metal and ceramics by blasting the micron particles of blasting abrasives.

微細バリ取り前
0.2mm
Before processing
微細バリ取り後
0.2mm
After processing

Roughening


Cleaning

It is possible to remove the dirt of surface, oxide film, paint film, plating, vapor-deposited film.

Damage on the surface can be very reduced by using the micron particles.

クリーニング加工図

Please order an experimental processing.


Consultation of device and processing


TEL:052-758-1102  FAX:052-758-1103
 

Please inquire of Here.