Usage of Elfo Blaster for minute powder
Fablication of precise patterns |
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・Minimum patternsWidth of lines :20um, Dot hole :40um, Pin pole :30um ・Aspect ratio2 times to 8 times of high aspect avairable ・Work materialsBrittle materials , such as crystal, glass, ceramics, compound semiconductor, silicon wafer, sapphire and metals ・Content of processingDrilling, Dicing, Pin pole, Grooving
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・Processing examples |
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Rib formation for PDP(Line:30um,High:180um) |
Ditch processing of glass (Line:20um) |
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Pin formation of ceramic |
Processing for ceramic gear |
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Ditch processing for dicing(Line:30um) |
Dimple processing |
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Processing for stainless pattern(Depth: 35um) |
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Micro Shot Peening |
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Constant blasting fine abrasive particles by high air pressure increases the strength of metal surface strength improvement of work material by fine abrasive particles wituout damaging.. As a result, longevity in cutlery and the metallic part can be greatly extended |
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Blast Coating |
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Metallic thin coating on plastics, glass and ceramics are available by blasting metallic particles with a high pressured nitrogen gas. Plastic thin coating on metal, ceramic and glass are available by blasting powder, such as PTFE.. |
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Blast coating of copper to the almina board |
Blast coating of silver to the glass (Line width:150um Space:45um) |
Suface Dulling |
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Fine dull finishing on the surface of metal and ceramics by blasting the micron particles of blasting abrasives. |
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0.2mm Before processing |
0.2mm After processing |
Roughening |
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Cleaning |
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It is possible to remove the dirt of surface, oxide film, paint film, plating, vapor-deposited film. Damage on the surface can be very reduced by using the micron particles. |
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Please order an experimental processing.
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Consultation of device and processing TEL:052-758-1102 FAX:052-758-1103 Please inquire of Here. |